
A unique set of tools for advanced materials and nanomanufacturing processes
Equipment

AJA R2R Sputtering System
The AJA sputter deposition tool provides industry standard vacuum deposition capability for a range of metals, dielectrics, and magnetic materials. In situ plasma cleaning combined with both RF ad DC pulsed magnetron source provide for state-of-the-art physical vapor deposition.
- R2R deposition on 6 inch wide films
- Capability to deposit metals, oxides, dielectrics and magnetic materials
- 4 Magnetron sputtering sources including one for magnetic materials
- 2000 W RF gen and 5 kW variable frequency (5-350 kHz) pulsed DC generator with dual output option
- Plasma cleaning system before deposition
- Shadow mask option for two targets
- Quartz crystal thickness monitoring for all sources
- Bidirectional motorized rollers with web tensioning and interleaf rollers
- Water cooled rollers to minimize substrate heating
- Targets in different size – smaller size for very expensive metals

Adphos Near IR 126-125 Drying / Sintering
- Wavelength: Peak in Near IR, extend to visible & IR
- Peak Power: 17.1 W/cm2

Besi Datacon 2200 Evo Plus R2R Pick and Place/Bonding Tool for Hybrid Integration
The web-based pick and place/die attach tool provides users with an advanced capability to develop methods for flexible-hybrid electronic circuit integration and system prototyping.
- Modified version of standard EVO 2200-Plus
- X/Y placement accuracy: ± 7 μm @ 3s
- Theta placement accuracy: ± 0.15° @ 3s
- Die attach: up to 7,000 UPH/module
- Flip chip

Dimatix DMP 2831
Additive 3D printing capabilities include both Aerosol Jet and Inkjet platforms providing versatility in terms of materials and inks available, range of viscosity, and post deposition cure by UV or IR photonic cure.
- Technology: Piezo Jet
- Feature size: 20µm
- Droplet size: 1-10 picoliter
- Nozzles: 12

Frontier Coater
The Frontier coater is a versatile tool enabling solution-based coatings over a range of viscosity and thicknesses for the development of advanced coatings.
- Web Width: 6” Max Coating 5.75”
- Line Speed: 1-30 FPM
- In-line Contact Web Cleaner with Static Control
- In-line Plasma/Corona Treater
- 250ml & 1 Liter Displacer Tubes with micro-metering pump for coating delivery
- Coating Heads:
- Precision Slot Die
- Reverse Microgravure
- Drying: 3 Zones
- 24” IR Dryer Zone 1
- Air floatation Hot Air Dryers with two 6’ Drying Zones
- 3 Optical Pyrometers measuring Web temperature
- UV Cure Station: Xenon RC847 LH 820 Lamp
- Hot Lamination Station (Max Temp 270°F)
- Mesys USM200C Coating Thickness Gauge On-line

LSL Dry Room
Dry and Wet labs enable process development under controlled environments for repeatable, reliable results. Dry room space further enable advanced materials development for applications such as batteries where moisture can cause detrimental outcomes.
Dry Room Specifications
- Interior Dimensions: 8’ D x 10’W x 10’H
- AirLock Dimensions: 4’D x 8’W x 10’H
- Windowed Door: 3’W x 7’ H Self Closing
- 4” Thick Wall Panels – Baked White embossed Galvanized Steel Interior and Exterior Finish
- Flooring: Crevice Free, Non-absorbent, Slip Free 90% Virgin Vinyl having temperature/dimensional stability from -40°C to +60°C
- 2 - 2.5’ W x 6’ L Lab Benches
- 2 - 1.6’ W x 6’L Open Wire Floor Shelving
- Temperature: Target 68 F (20°C)
Control +/- 1° C
Uniformity No greater than +/- 2° C - Humidity: Not to Exceed 2.0%RH at -28° C Dew point
- Maximum Personnel Load: 2 people
- Exhaust Air: Minimum 50 CFM
- Maximum Allowable Door Openings: 2 per hour
- Door Opening Recovery Period: 3 minutes after a 15 Second Door Opening.
- Nitrogen Gas Lines: 2 available

Nanonex NX-2608BA
The Nanonex Nanoimprint Lithography Tool provides state-of-the-art capability for patterning, alignment, and direct printing of multiple materials for printed electronics. The sheet-printing capability provides unprecedented pattering of critical features and alignment resolution.
Key Features
All forms of Nanoimprint
- Thermoplastic
- Photocurable
- Simultaneous thermal and UV NIL
- Air Cushion Press (ACP) technology provides excellent uniformity over entire substrate
- High Throughput
- Sub 10 nm imprint resolution
- Sub-1 µm Overlay alignment frontside and optional backside alignment
- Smart sample holder
- Substrate size – up to 8 inch wafers
- Temperature range of 0 to 250°C
- Pressure range of 0 to 500 psi
- 200W Narrow band UV lamp
- Automatic control
- Alignment
- X, Y, Z, Theta Stage
- Split Field Optics and CCD Camera
- Photolithography
- 5 inch mask standard
- UV source 500 W Mercury lamp
- User friendly control software

Optomec Aerosol Jet 300
Additive 3D printing capabilities include both Aerosol Jet and Inkjet platforms providing versatility in terms of materials and inks available, range of viscosity, and post deposition cure by UV or IR photonic cure.
- Technology: Aerosol jet
- Feature size: 10 µm
- Droplet size: 1-5 picoliter

Pro-Lam 1200 Lab Scale Laminator/Slitter
- Lamination Widths: 4” -12”
- Speed Control: Variable and reversible 18 FPM Max.
- Maximum Laminate Thickness: 0.010”
- Maximum Substrate Thickness: 0.25”
- Micro-Adjustable Slitter Blades with infinite slitting widths from 1”-12”

PulseForge 1300 Photonic Sintering
Pulseforge photonic cure offers visible and UV spectral sources for photothermal processing of coatings and composites in a batch format.
- Wavelength: Peak in Visible, extend to UV & IR
- Peak Power: 2.4x104 W/cm2
R2R Contact Lithography Active Alignment Registration
Moving web tool uses gravure/meyer-rod coating of functional resist or thin-film with contact print to mask pattern for direct photolithographic exposure by UV source. Imaging feedback enables active alignment of patterns.

R2R Direct Write Test Frame
Roll to roll direct write test frame incorporates direct image photolithographic patterning of coating implemented by inkjet or gravure coating. The digital patterning is enabled by DLP imaging, and target registration alignment uses an active pattern recognition feedback feature.

R2R Nanoimprint Lithography
The R2R NanoImprint tool provides a unique suite of capabilities enabling innovative process development including patterning across multiple length-scales, and direct printing of a range of materials compositions.
- Next Generation Tool Based on Nano Emboss 100 Platform
- Adds Thermal Imprint, Solvent Assisted, Soft and Optical Contact Lithography
- Equipped with NIR Anneal
- Enables Direct Printing of Metal Oxides

R2R Inkjet Printer/Gravure Coater with Photonic Cure
This custom R2R tool provides state-of-the-art capability for development of advanced materials and inks for emerging printed electronic applications. The platform includes Xaar inkjet print head arrays combined with Novacentrix Photonic cure and Adphos Near IR drying.
- Technology: PiezoJet
- Feature size: 20µm
- Droplet size: 6-42 picoliters
- Nozzles: 1000
- Near IR Drying: Adphos 126-125
- Sintering: Novacentrix PulseForge 1300

ramé-hart Model 210 Goniometer / Tensiometer
The ramé-hart Model 210 Goniometer / Tensiometer is a powerful tool for measuring contact angle, surface energy, surface tension, and interfacial tension. Model 210 (previously Model 200) includes DROPimage Pro as well as a fiber optic illuminator, 3-axis leveling stage, and U4 Series 520 frames/second SuperSpeed digital camera. The system has complete turn-key system with PC and LCD and microsyringe fixture and assembly for manual dispensing.

Trion R2R DRIE & IBM System
The Trion Deep Reactive Ion and Ion Beam Etcher provides vacuum-based dry etch capability compatible with several substrates (plastic, glass, metal foil). Multiple gases enable versatile etch chemistries for dielectric, metal, and polymer composites.
- R2R DRIE/IBM system for 6 inch wide films (plastic / metal foils)
- Anisotropic etch capability enabling residual layer removal, patterns transfer and surface treatment in R2R process – less than +/- 4% etch uniformity
- 8000 W Extreme source 13.56MHz RF generator
- 8 gases (CF4, O2, SF6, He, Ar, CHF3, 2 blank slots)
- Ion beam Milling (IBM) chamber with 2 linear gridless source – less than +/-2.5% etch uniformity – separate chamber
- Thickness monitoring mechanism
- Capability to etch polymers, dielectrics, and thin metal films
- Interleaf rollers, web handing system and web tension control
- Automatic and manual tuning options

UMass Slitter/Laminator
This custom built atmospheric slitter/laminator tool enables final sizing, slitting and lamination steps to be completed for prototyping and test.
- Material Web Width: 12” Maximum
- Slitter Speed/Laminator Speed: 20 MPM
- Interleaf Take-up Roll at Unwind
- Dual Side Lamination or Slitting Capability
- Heated Nip Rolls 320°F Max.
- Rotary Sheer Slitting Blades
- Dual Differential Rewind Shafts
Northfield Automation – Atmospheric Laminator
- Lamination Widths: 4” -12”
- Speed Control: Variable and reversible 18 FPM Max.
- Maximum Laminate Thickness: 0.010”
- Maximum Substrate Thickness: 0.25”
- Micro-Adjustable Slitter Blades with infinite slitting widths from 1”-12”
Location
S440 Life Science Laboratories
University of Massachusetts Amherst
240 Thatcher Road
Amherst, MA 01003