Roll-to-Roll Fabrication & Processing Facility


Roll-to-Roll Fabrication and Processing Facility

A unique set of tools for advanced materials and nanomanufacturing processes

Located on the 4th floor in the Life Science Laboratories the Roll to Roll Fabrication and Processing (R2R) facility provides a unique set of custom, moving web-based tools for the translation of advanced materials and nanomanufacturing processes to industrially relevant scalable platforms for the development of next generation life science innovations in biosensors, diagnostics, and platforms for personalized health monitoring. Combined with additional web-based tools for vacuum sputter deposition, reactive ion etching, wet chemistry, and interlayer alignment, providing access to an emerging set of tools not found anywhere else.

What We Do

In combination with supporting student researchers, the R2R facility provides the expertise of professional staff with years of experience in the coating and flexible electronics industries to meet the near term and future needs of industry in developing their next generation products. Contributing towards a significant economic impact in Massachusetts and nationally in working closely with industry partners to solve critical process bottlenecks, enabling critical demonstrations of prototype products, and working to scale these processes to pilot manufacturing. This unprecedented facility, within an academic institution, allows rapid development for small, medium, and large companies to develop products without the upfront capital equipment investment, or need to shut down a production line in order to develop next generation products. Thus, a new paradigm in advanced manufacturing is presented which becomes more efficient, and accelerates the timeline to manufacturing.

The impact has been clear, creating new jobs, attracting substantial investment, and creating partnerships and mergers between companies, and enhancing competitiveness throughout the value chain. While this impact is recognized across the range of applications for coatings and flexible electronics, the largest impact by far is in the energy and environmental application sector, thereby have a broader socioeconomic benefit. These include batteries and energy storage ultra filtration, carbon sequestration, and printed photonics. The figure to the right illustrates a coating in process on the Frontier Slot Die Coating system. Our staff work closely with industry partners and sponsors to optimize the coating process parameters, thereby establishing a baseline for pilot production and scaled manufacturing. In addition, our team woks closely with industry partners to run trials evaluating and optimizing formulation, process variations, and systematic configurations in order to provide a solid base to take this product to the next manufacturing level.

​​​​​​​Work With Us

We offer training to users to develop processes and conduct experimentation for use on a fee for service basis to both internal and external researchers, academic or industry based. Following an initial consultation to better understand the user’s goals, process or device interests, suggested tool capabilities, experimental parameters, training and access is arranged through the director. Facility staff and faculty researchers are available to assist on an as-needed basis, or through collaborative programs leveraging targeted expertise. For further information, please contact the facility director.

Equipment

AJA R2R Sputtering System

AJA R2R Sputtering System

The AJA sputter deposition tool provides industry standard vacuum deposition capability for a range of metals, dielectrics, and magnetic materials. In situ plasma cleaning combined with both RF ad DC pulsed magnetron source provide for state-of-the-art physical vapor deposition.

  • R2R deposition on 6 inch wide films
  • Capability to deposit metals, oxides, dielectrics and magnetic materials
  • 4 Magnetron sputtering sources including one for magnetic materials
  • 2000 W RF gen and 5 kW variable frequency (5-350 kHz) pulsed DC generator with dual output option
  • Plasma cleaning system before deposition
  • Shadow mask option for two targets
  • Quartz crystal thickness monitoring for all sources
  • Bidirectional motorized rollers with web tensioning and interleaf rollers
  • Water cooled rollers to minimize substrate heating
  • Targets in different size – smaller size for very expensive metals
Adphos Near IR 126-125 Drying / Sintering

Adphos Near IR 126-125 Drying / Sintering

  • Wavelength: Peak in Near IR, extend to visible & IR
  • Peak Power: 17.1 W/cm2
Besi Datacon 2200 Evo Plus R2R Pick and Place/Bonding Tool for Hybrid Integration

Besi Datacon 2200 Evo Plus R2R Pick and Place/Bonding Tool for Hybrid Integration

The web-based pick and place/die attach tool provides users with an advanced capability to develop methods for flexible-hybrid electronic circuit integration and system prototyping.

  • Modified version of standard EVO 2200-Plus
  • X/Y placement accuracy: ± 7 μm @ 3s
  • Theta placement accuracy: ± 0.15° @ 3s
  • Die attach: up to 7,000 UPH/module
  • Flip chip
Dimatix DMP 2831

Dimatix DMP 2831

Additive 3D printing capabilities include both Aerosol Jet and Inkjet platforms providing versatility in terms of materials and inks available, range of viscosity, and post deposition cure by UV or IR photonic cure.

  • Technology: Piezo Jet
  • Feature size: 20µm
  • Droplet size: 1-10 picoliter
  • Nozzles: 12
Frontier Coater

Frontier Coater

The Frontier coater is a versatile tool enabling solution-based coatings over a range of viscosity and thicknesses for the development of advanced coatings.

  • Web Width: 6” Max Coating 5.75”
  • Line Speed: 1-30 FPM
  • In-line Contact Web Cleaner with Static Control
  • In-line Plasma/Corona Treater
  • 250ml & 1 Liter Displacer Tubes with micro-metering pump for coating delivery
  • Coating Heads:
    • Precision Slot Die
    • Reverse Microgravure
  • Drying: 3 Zones
    • 24” IR Dryer Zone 1
    • Air floatation Hot Air Dryers with two 6’ Drying Zones
    • 3 Optical Pyrometers measuring Web temperature
  • UV Cure Station: Xenon RC847 LH 820 Lamp
  • Hot Lamination Station (Max Temp 270°F)
  • Mesys USM200C Coating Thickness Gauge On-line
LSL Dry Room

LSL Dry Room

Dry and Wet labs enable process development under controlled environments for repeatable, reliable results. Dry room space further enable advanced materials development for applications such as batteries where moisture can cause detrimental outcomes.

Dry Room Specifications

  • Interior Dimensions: 8’ D x 10’W x 10’H
  • AirLock Dimensions: 4’D x 8’W x 10’H
  • Windowed Door: 3’W x 7’ H Self Closing
  • 4” Thick Wall Panels – Baked White embossed Galvanized Steel Interior and Exterior Finish
  • Flooring: Crevice Free, Non-absorbent, Slip Free 90% Virgin Vinyl having temperature/dimensional stability from -40°C to +60°C
  • 2 - 2.5’ W x 6’ L Lab Benches
  • 2 - 1.6’ W x 6’L Open Wire Floor Shelving
  • Temperature: Target 68 F (20°C)
    Control +/- 1° C
    Uniformity No greater than +/- 2° C
  • Humidity: Not to Exceed 2.0%RH at -28° C Dew point
  • Maximum Personnel Load: 2 people
  • Exhaust Air: Minimum 50 CFM
  • Maximum Allowable Door Openings: 2 per hour
  • Door Opening Recovery Period: 3 minutes after a 15 Second Door Opening.
  • Nitrogen Gas Lines: 2 available
Nanonex NX-2608BA

Nanonex NX-2608BA

The Nanonex Nanoimprint Lithography Tool provides state-of-the-art capability for patterning, alignment, and direct printing of multiple materials for printed electronics. The sheet-printing capability provides unprecedented pattering of critical features and alignment resolution.

Key Features
All forms of Nanoimprint

  • Thermoplastic
  • Photocurable
  • Simultaneous thermal and UV NIL
  • Air Cushion Press (ACP) technology provides excellent uniformity over entire substrate
  • High Throughput
  • Sub 10 nm imprint resolution
  • Sub-1 µm Overlay alignment frontside and optional backside alignment
  • Smart sample holder
  • Substrate size – up to 8 inch wafers
  • Temperature range of 0 to 250°C
  • Pressure range of 0 to 500 psi
  • 200W Narrow band UV lamp
  • Automatic control
  • Alignment
    • X, Y, Z, Theta Stage
    • Split Field Optics and CCD Camera
  • Photolithography
    • 5 inch mask standard
    • UV source 500 W Mercury lamp
  • User friendly control software
Optomec Aerosol Jet 300

Optomec Aerosol Jet 300

Additive 3D printing capabilities include both Aerosol Jet and Inkjet platforms providing versatility in terms of materials and inks available, range of viscosity, and post deposition cure by UV or IR photonic cure.

  • Technology: Aerosol jet
  • Feature size: 10 µm
  • Droplet size: 1-5 picoliter
Pro-Lam 1200 Lab Scale Laminator/Slitter

Pro-Lam 1200 Lab Scale Laminator/Slitter

  • Lamination Widths: 4” -12”
  • Speed Control: Variable and reversible 18 FPM Max.
  • Maximum Laminate Thickness: 0.010”
  • Maximum Substrate Thickness: 0.25”
  • Micro-Adjustable Slitter Blades with infinite slitting widths from 1”-12”
PulseForge 1300 Photonic Sintering

PulseForge 1300 Photonic Sintering

Pulseforge photonic cure offers visible and UV spectral sources for photothermal processing of coatings and composites in a batch format.

  • Wavelength: Peak in Visible, extend to UV & IR
  • Peak Power: 2.4x104 W/cm2

R2R Contact Lithography Active Alignment Registration

Moving web tool uses gravure/meyer-rod coating of functional resist or thin-film with contact print to mask pattern for direct photolithographic exposure by UV source. Imaging feedback enables active alignment of patterns.

R2R Direct Write Test Frame

R2R Direct Write Test Frame

Roll to roll direct write test frame incorporates direct image photolithographic patterning of coating implemented by inkjet or gravure coating. The digital patterning is enabled by DLP imaging, and target registration alignment uses an active pattern recognition feedback feature.

R2R Nanoimprint Lithography

R2R Nanoimprint Lithography

The R2R NanoImprint tool provides a unique suite of capabilities enabling innovative process development including patterning across multiple length-scales, and direct printing of a range of materials compositions.

  • Next Generation Tool Based on Nano Emboss 100 Platform
  • Adds Thermal Imprint, Solvent Assisted, Soft and Optical Contact Lithography
  • Equipped with NIR Anneal
  • Enables Direct Printing of Metal Oxides
R2R Inkjet Printer/Gravure Coater with Photonic Cure

R2R Inkjet Printer/Gravure Coater with Photonic Cure

This custom R2R tool provides state-of-the-art capability for development of advanced materials and inks for emerging printed electronic applications. The platform includes Xaar inkjet print head arrays combined with Novacentrix Photonic cure and Adphos Near IR drying.

  • Technology: PiezoJet
  • Feature size: 20µm
  • Droplet size: 6-42 picoliters
  • Nozzles: 1000
  • Near IR Drying: Adphos 126-125
  • Sintering: Novacentrix PulseForge 1300
ramé-hart Model 210 Goniometer / Tensiometer

ramé-hart Model 210 Goniometer / Tensiometer

The ramé-hart Model 210 Goniometer / Tensiometer is a powerful tool for measuring contact angle, surface energy, surface tension, and interfacial tension. Model 210 (previously Model 200) includes DROPimage Pro as well as a fiber optic illuminator, 3-axis leveling stage, and U4 Series 520 frames/second SuperSpeed digital camera. The system has complete turn-key system with PC and LCD and microsyringe fixture and assembly for manual dispensing. 

Trion R2R DRIE & IBM System

Trion R2R DRIE & IBM System

The Trion Deep Reactive Ion and Ion Beam Etcher provides vacuum-based dry etch capability compatible with several substrates (plastic, glass, metal foil). Multiple gases enable versatile etch chemistries for dielectric, metal, and polymer composites.

  • R2R DRIE/IBM system for 6 inch wide films (plastic / metal foils)
  • Anisotropic etch capability enabling residual layer removal, patterns transfer and surface treatment in R2R process – less than +/- 4% etch uniformity
  • 8000 W Extreme source 13.56MHz RF generator
  • 8 gases (CF4, O2, SF6, He, Ar, CHF3, 2 blank slots)
  • Ion beam Milling (IBM) chamber with 2 linear gridless source – less than +/-2.5% etch uniformity – separate chamber
  • Thickness monitoring mechanism
  • Capability to etch polymers, dielectrics, and thin metal films
  • Interleaf rollers, web handing system and web tension control
  • Automatic and manual tuning options
UMass Slitter/Laminator

UMass Slitter/Laminator

This custom built atmospheric slitter/laminator tool enables final sizing, slitting and lamination steps to be completed for prototyping and test.

  • Material Web Width: 12” Maximum
  • Slitter Speed/Laminator Speed: 20 MPM
  • Interleaf Take-up Roll at Unwind
  • Dual Side Lamination or Slitting Capability
  • Heated Nip Rolls 320°F Max.
  • Rotary Sheer Slitting Blades
  • Dual Differential Rewind Shafts

Northfield Automation – Atmospheric Laminator

  • Lamination Widths: 4” -12”
  • Speed Control: Variable and reversible 18 FPM Max.
  • Maximum Laminate Thickness: 0.010”
  • Maximum Substrate Thickness: 0.25”
  • Micro-Adjustable Slitter Blades with infinite slitting widths from 1”-12”

Staff

    • Device Fabrication and Process Development Engineer 

    Lu Sun

  • Location

    S440 Life Science Laboratories
    University of Massachusetts Amherst
    240 Thatcher Road
    Amherst, MA 01003