Rapid 3D Patterning of Nanoparticle Materials Using Direct Incident Beam Lithography

Primary Inventors: 

Yuval Ofir, Ph.D.,  Vincent M. Rotello, Ph.D.,  Mark T. Tuominen, Ph.D., Qijun Xiao, and Bappaditya Samanta


This technology provides a simple, "direct-write" method to generate three-dimensional (3D) lithographic patterns of various nanoparticle materials such as metal, semiconductor, insulator and magnetic materials. In contrast to the standard electron beam lithography, which requires a multi-step process to pattern micro- or nano-structures on surfaces, this technology allows for a single-step patterning of a wide variety of nanoparticle films for the fabrication of 1-3D features in the nano-micro length scale.

  • Magnetics: Patterned media for hard disk drives; hard magnetic materials for motors and generators; route to good spring-exchange materials; patterned soft magnetic materials for RF/micro electronics.
  • Photonics/Plasmonics: NIR materials and applications; plasmonic waveguides, horns and devices; polarizers and filters.
  • 3D structures for electronics and MEMs/NEMs: RF MEMS/NEMs such as inductors, switches, antennas, resonators, transmission lines, actuators, valves, Hall voltage sensors, tunneling magnetometers; RFID tags; electrodes and metal lines.
  • Simple and rapid patterning process: 3D features such as raised portions and bridges can be fabricated in a single "direct-write" step.
  • Multiple writing modes: Serial, parallel or a combination of serial and parallel writing modes can be used to fabricate desired 1-3D features.
  • Broad applicability: This technology can be used to pattern a wide variety of nanoparticle materials such as metal, metal oxides, metal alloys, semiconductor, insulator and magnetic materials with a wide choice of ligand systems such as thiols, phosphates, amines, pyridines, etc.
  • High flexibility and utility in nano/micro-fabrication: Various flat substrates or three-dimensional templates can be used in nano/micro-fabrication to generate complex 3D product structure via sequential structure formation.
Licensing Status: 
Available for Licensing or Sponsored Research
Patent Status: 
UMA 07-39
For More Information: 

Ling X. Shen, Ph.D., M.B.A.
Senior Licensing Officer
Commercial Ventures and Intellectual Property

Phone: 413-545-5276
E-mail: lxshen@research.umass.edu