Equipment for precise integration of optical and electronic components into compact systems. Tools and equipment are available for wafer dicing, die mounting and alignment, and wirebonding and metal trim providing a complete set of capabilities for preparing sensors and integrated systems for evaluation and test.
- Vector Network Analyzer E5071c 8.5 GHz
- Flip Chip Bonder Finetech FINEPLACER
- Wafer Saw Advanced Dicing Technology 7122
|Campus Users||External Users|
|Lab Access (per user)||$250/quarter||$500/quarter|
|Rates are subject to change, contact facility to verify current fees.|
|Updated June 7, 2017|