Besi Datacon 2200 Evo Plus R2R Pick and Place/Bonding Tool for Hybrid Integration
The web-based pick and place/die attach tool provides users with an advanced capability to develop methods for flexible-hybrid electronic circuit integration and system prototyping.
- Modifed version of standard EVO 2200-Plus
- X/Y placement accuracy: ± 7 μm @ 3s
- Theta placement accuracy: ± 0.15° @ 3s
- Die attach: up to 7,000 UPH/module
- Flip chip