The University of Massachusetts Amherst

Besi Datacon 2200 Evo Plus R2R Pick and Place/Bonding Tool for Hybrid Integration

The web-based pick and place/die attach tool provides users with an advanced capability to develop methods for flexible-hybrid electronic circuit integration and system prototyping.

  • Modifed version of standard EVO 2200-Plus
  • X/Y placement accuracy: ± 7 μm @ 3s
  • Theta placement accuracy: ± 0.15° @ 3s
  • Die attach: up to 7,000 UPH/module
  • Flip chip

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