Nanofabrication Cleanroom
Located on the 1st floor in the Silvio O. Conte National Center for Polymer Research the Nanofabrication facility is part of a network of cleanroom laboratories that offer both unique and complimentary capabilities. Training can be tailored to the specific set of processes or techniques needed to fabricate and test various devices or materials. Films of numerous metals and ceramics can be applied and patterning as small as sub-tens of nm can be accomplished. A wet chemistry area provides a safe environment for the use of a variety of coatings, solvents, and etchants.
The facility accepts samples and will perform requested analysis. We offer training to users to conduct experimentation for use on a fee for service basis to both internal and external researchers, academic or industry based. Following an initial consultation, covering experimental parameters training and access is arranged through the director.
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JEOL JSM-7001F Ebeam Writer with Nanometer Pattern Generation System
The Electron Beam Lithography system is based on a JEOL JSM-7001F Thermal Field Emission SEM equipped with a Nabity Nanometer Pattern Generation System which supports e-beam lithography and an image database.
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STS Vision 310 Mark II PECVD System
The STS Vision 310 Plasma Enhanced Chemical Vapor Deposition system is equipped with a patented frequency generator that allows for the deposition of low stress films. It is configured for the growth of silicon dioxide, silicon nitride, and amorphous silicon. Available gases are 2% silane/nitrogen, ammonia, nitrous oxide, tetrafluoromethane, oxygen, methane, and nitrogen.
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STS Vision 320 Mark II RIE System
The STS Vision 320 Reactive Ion Etch system is configured to etch silicon dioxide, silicon nitride, and amorphous slicon. Available gases are hydrogen, methane, sulphur hexafluoride, trifluoromethane, oxygen, argon, and nitrogen.
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Gaertner L116C Ellipsometer
The Gaertner L116C Ellipsometer offers noncontact measurement of transparent and translucent films using a 632.2 nm wavelength HeNe laser. The rotating analyzer samples 144 data points and can measure films of thickness from 0 to 60000 Å with an accuracy of +/-3 Å and a repeatability of +/-1 Å over most of the measurement range.
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AJA International Orion 8 Sputtering System with Load Lock Chamber
The load-locked AJA ORION 8 Sputtering System currently has three RF and four DC confocal magnetron sputtering sources installed. Current source materials available include copper, aluminum, silicon dioxide, titanium dioxide, aluminum oxide, indium tin oxide, magnesium oxide, tantalum oxide, cobalt, palladium, niobium, silver, nickel, tantalum, sammarium, sammarium cobalt, zirconium, chromium, vanadium, and Permalloy (Ni/Fe). Programmable control of deposition parameters and cycling allows simultaneous or sequential deposition and repetition of deposition cycles. Substrate heating up to 750°C is also programmable.
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CHA Electron Beam Evaporator with Cryopump
The CHA SE-600 electron beam evaporator with a 4 pocket hearth has been retrofitted with a cryopump to decrease the pumping cycle time. More than twenty different metals can be evaporated including gold, platinum, palladium, silver, copper, aluminum, nickel, and titanium.
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Cambridge NanoTech Atomic Layer Deposition (ALD) System
The Cambridge NanoTech Savannah 100 Atomic Layer Deposition (ALD) system is available to deposit very conformal and precise thicknesses of various thin films. Our unit can currently be configured with the precursor chemicals to deposit hafnium oxide, aluminum oxide, titanium dioxide, zinc oxide, and platinum.
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Wentworth MP-2300 Probe Station
The Wentwort MP-2300 semiautomatic 200mm wafer prober is equipped with Labmaster 5.1 probing environment software and has a motorized XY- theta stage with 203mm x 203mm XY travel with 0.1um resolution and 5 mm Z travel and a 200mm nickel plated wafer chuck with vacuum hold down. Probers include a CAP3000 computer assisted probe with 0.1 um resolution, a CAP4000 submicron computer assisted probe with 0.01 um resolution and two lower resolution manual probers. A Mitutoyo FS-70 microscope with motorized xyz movement and M Plan Apo 5x,10x,20x objectives and Pulnix TMC-7 CCD camera with flat panel monitor and motorized focus allow for visual scanning and image capture. A Newport Cleantop II vibration isolation table with maximum damping and a laminar flow hood provide a controlled probing environment.
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Keithley 4200 SCS Parametric Analyzer
The Keithley 4200 Semiconductor Characterization System is a parametric analyzer with a Windows XP based software environment which provides for measurement of DC I-V, C-V, and pulse characterization and stress- measurement/reliability testing of semiconductor devices and test structures. This instrument is equipped with a Capacitance Voltage Unit capable of nanoFarad (nF) level measurements at frequencies from 10kHz to 10MHz and also two Source-Measure Units with 1A/20W capability. Two Remote PreAmps extend the resolution of both SMUs from 100fA to 0.1fA.
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Dektak 3 Profilometer
The Veeco Dektak3 surface profile measurement system is capable of scans up to 30 mm with a 10 Å repeatability and the sensitivity to measure step heights below 100 Å.
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March Instruments PM-600 Plasma Treatment System
The PM-600 is a large barrel benchtop plasma system with a 13.56 MHz RF generator having an output power of up to 600W for stripping photoresist, cleaning substrates, and mild etching. It has a 10 in. diameter by 12 in. long quartz chamber with an 8 inch by 8 inch flat quartz glass substrate rack Quartz glass wafer racks are available for 3” diameter wafers. It is microprocessor based with automatic sequencing and manual override.
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Nikon Optiphot Microscope with Infinity 2 Digital Camera
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OAI 1000 Watt DUV Exposure System
The OAI 1000 Watt DUV Exposure System is capable of exposing substrates up to 150 mm diameter to a 1000W ~250nm wavelength deep ultra-violet light source. Samples are placed in the exposure chamber and the time of exposure can be varied - the power setting is always 1000W.
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Olympus BH2 Microscope with Infinity 2 Digital Camera
The Olympus BH2 Microscope with Infinity 2 high resolution (2080x1536 pixel) digital camera is capable of up to 1000x magnification and has a 6 in. x 6 in. stage with manual positioning lever and xy stage control knobs. Image captures on the attached notebook computer canbe analyzed, labeled or formatted, and saved to network storage areas via the internet. Nosepiece rotation is under push button control.
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SUSS MicroTec MA6 Mask Aligner
A UV mask aligner and exposure system with split screen stereo camera alignment system capable of both front and back side alignment of from 2” to 6” diameter substrates.
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Brewer Science CEE 100CB Spin Coater
The Brewer Science CEE 100CB Spin Coater and Hot Plate is capable of storing up to 10 spin regimes which may include spin speed ramp rate, stepped spin speeds, and a nitrogen float or vacuum hot plate contact mode for photoresist curing. Chucks for substrates from 1” to 6” diameter are available.
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Developer Hood
The Developer Hood has a flowing deionized water rinse sink and developer solution sinks for the positive and negative resists commonly used in the facility. DI rinse wands and N2 guns are provided.
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Sonoplot GIX Microplotter II
- Noncontact deposition
- Features as small as 5μm
- Viscosities up to 450 cP
- True contiguous lines, arcs, and bends
- Consistent spot size and shape with coefficients of variability as low as 10%
- 3-axis positioning with 5μm resolution
- Integrated digital video capture
- Automated surface calibration
- Interchangeable holding platen for a variety of substrate sizes
- SonoGuide™ software for full automation and control
- SonoDraw™ software as a CAD layout tool
Service Line | Campus Users | Other Academic Institutions | Industry |
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Annual Access | $1,365 | $1,732.50 | $2,887.50 |
Additional Users |
$68.25/month | $84/month | $110.25/month |
R to R Nano Imprinter | $451.50/day | $661.50/day | $871.50/day |
R to R Coater | $225.75/day | $435.75/day | $682.50/day |
Equipment Usage | $47.25/hour | $47.25/hour | $73.50/hour |
Technical Assistance | $47.25/hour | $47.25/hour | $73.50/hour |
Special Materials and Processes | $57.75/process | $57.75/process | $57.75/process |
Rates are subject to change, contact facility to verify current fees. | |||
FY25 Specialized Service Center Approved Fees |
Training for new users consists of:
- lab orientation tour,
- explanation of clean room policies and lab safety,
- training on operation of needed equipment,
- consultation on photomask design and layout,
- assistance in designing process procedures,
- training on safe use of wet chemistry benches.
Once the training is complete, researchers may schedule their experiments through the director of Nanofabrication or online through CORUM at corum.umass.edu.
Nanofabrication Cleanroom: The Nanofabrication facility is part of a network of cleanroom laboratories that offer both unique and complementary capabilities. Training can be tailored to the specific set of processes or techniques needed to fabricate and test various devices or materials. Films of numerous metals and ceramics can be applied and patterning as small as 10 nm can be accomplished. A wet chemistry area provides a safe environment for the use of a variety of coatings, solvents, and etchants. Equipment includes:
- JEOL JSM-7001F Ebeam Writer with Nanometer Pattern Generation System
- STS Vision 310 Mark II PECVD System
- STS Vision 320 Mark II RIE System
- Gaertner L116C Ellipsometer
- AJA International Orion 8 Sputtering System with Load Lock Chamber
- CHA Electron Beam Evaporator with Cryopump
- Cambridge NanoTech Atomic Layer Deposition (ALD) System
- Wentworth MP-2300 Probe Station
- Keithley 4200 SCS Parametric Analyzer
- Dektak 3 Profilometer
- March Instruments PM-600 Plasma Treatment System
- Nikon Optiphot Microscope with Infinity 2 Digital Camera
- Blue M Convection Oven
- OAI 1000 Watt DUV Exposure System
- Olympus BH2 Microscope with Infinity 2 Digital Camera
- SUSS MicroTec MA6 Mask Aligner
- Brewer Science CEE 100CB Spin Coater
- Developer Hood
- Sonoplot GIX Microplotter II
- Training: Training for new users consists of: lab orientation tour, explanation of clean room policies and lab safety, training on operation of needed equipment, consultation on photomask design and layout, assistance in designing process procedures, training on safe use of wet chemistry benches.
CORUM (access and reservations)
4-Methyl-2-Pentanone
950 PMMA in Anisole
Acetone
Aluminum Etchant Type A
Ammonia NH3
AMMONIUM HYDROXIDE
AR_N 7520 Ebeam Resist
AR-P 6200 E-Beam Resist
AR-PC 5090, 5091 Coating
AR 300-40 Developer
Argon Ar
AZ 300 MIF Developer
AZ 3318D PHOTORESIST (30 CPS)
AZ 400T Photoresist Stripper
PRS 1000 Positive Photoresist Stripper
Buffered Oxide Etch 10:1
N-Butyl Acetate BX1735
CHROMIUM ETCH 1020 GHS
CR-7 Etchant
Cyclopentanone
N,N-DIMETHYLFORMAMIDE
N,N-Dimethylformamide
DMSO DIMETHYL SULFOXIDE
Fomblin Oil
Galden HT200
HMDS
Hydrochloric Acid
Hydrofluoric Acid
Hydrogen H2
Isopropyl Alcohol
KL6000 Photoresist
LOR 5A Lift Off Resist
Developer for Photoresist ma-D 525
Methane CH4
Methanol
Methyl Iso-Butyl Ketone
MICROPOSIT MF-319
MMA 8.5
Remover for Photoresist mr-Rem 400
SU-8 Developer
Nanostrip
NITRIC AC 65%
Nitrogen N2
NitrousOxide NO2
1-Methyl-2-pyrrolidinone (NMP), ACS 99%
NR71-3000P Negative Photoresist
NR9-1000PY Photoresist
NR9-500PY Photoresist
Oxygen O2
PGMEA
Photoresist Stripper AZ 400T
POTASSIUM HYDROXIDE
RD6 Developer
Remover for Photoresist mr-Rem 660
RemoverPG
Resist Remover RR41
Futurrex_Remover_RR41
Shipley 1813 Photoresist
Shipley 351 Developer
Silane-2 percent Si3H4-Nitrogen Balance -N2
SU-8 Photoresist
Sulfur Hexafluoride SF6
Tetrafluoromethane CF4
Tetrakis(dimethylamido)hafnium
Tetrakis(dimethylamido)titanium
TKO-19 Vacuum Pump Oil
Toluene
Transene APS-100 Copper Etchant
Transene TE-100 Tin Oxide Etchant
Trifluoromethane CHF3
Trimethylaluminum
(Trimethyl)methylcyclopentadienylplatinum
XYLENE
ZED-N50 Developer
ZEP-520A Ebeam Resist
The cleanroom lab is located on the campus of UMass Amherst, in the Silvio O. Conte National Center for Polymer Research, room B-132.
From the East
From Route 2 West, take exit 16 (Belchertown/Amherst). Follow Route 202 for about 15 miles to blinking light at Route 9 and 116 Amherst exit (Pelham). Turn right and follow for 7 miles to Amherst center. Follow signs to UMass.
From I-90 (Mass Pike), take exit 4 (West Springfield). Follow I-91 North to Exit 19. From the exit ramp, turn right onto Route 9. Travel approximately 4.5 miles to Route 116 North (turn left at traffic lights). UMass exit is 1 mile.
From the South
From I-91 North, take Exit 19 in Northampton. From the exit ramp, turn right onto Route 9. Travel approximately 4.5 miles to Route 116 North (turn left at traffic lights). UMass exit is 1 mile.
From the West
From Route 2 East, follow to Greenfield/I-91 exit. Take I-91 South to exit 25 in Deerfield. At the end of the ramp turn left and follow the road to the intersection. Turn right onto Routes 5 & 10 South. Go 1 mile, then turn left onto Route 116 South. Follow for 8 miles to the UMass exit.
From I-90 (Mass Pike), take exit 4 (West Springfield). Follow I-91 North to Exit 19. From the exit ramp, turn right onto Route 9. Travel approximately 4.5 miles to Route 116 North (turn left at traffic lights). UMass exit is 1 mile.
From the North
From I-91 South, take exit 25 in Deerfield. At the end of the ramp, turn left and follow road to the intersection. Turn right onto Routes 5 & 10 South. Go 1 mile, then turn left onto Route 116 South. Follow 8 miles to the UMass exit.
Equipment documentation is available on Box