Sensor Integration


Sensor Integration

Fabrication of Miniaturized Electronic Systems

Located on the 4th floor in the Life Science Laboratories the Sensor Integration facility has equipment for precise integration of optical and electronic components into compact systems. Equipment includes probe station with laser cutter, wafer saw, wire bonders, a flip chip bonder, via plating, and a laser PCB prototyping tool.

We offer training to users to conduct experimentation for use on a fee for service basis to both internal and external researchers, academic or industry based. Following an initial consultation, covering experimental parameters training and access is arranged through the director.

Equipment

Summit 11000 Probe Station with Laser Cutter

Summit 11000 Probe Station with Laser Cutter

For measuring and modifying prototype integrated circuits

  • EZLaze3 laser cutter:
    • for cutting metal traces (532 nm)
    • for removing passivation (355 nm)
  • Objectives: M Plan Apo NUV 50X, 100X
Advanced Dicing Technology 7122

Advanced Dicing Technology 7122

For precision dicing of hard material components such as
silicon wafers

  • Work piece size: up to 200mm x 200mm
  • Indexing: resolution/accuracy is 0.2 μm/1.5 μm
  • Cut Depth: resolution/accuracy is 0.2 μm/2.0 μm
LPKF Protolaser U3

LPKF Protolaser U3

For prototyping of printed circuit boards

  • Diameter of UV laser beam 20μm
  • Resolution of scanfield 2μm
  • Repeatability +/- 2μm
  • Surface structures down to 75μm
  • Max material size 9” x 12” x 0.27”
FineTech FINEPLACER pico ma

FineTech FINEPLACER pico ma

For flip chip bonding and die attach

  • Placement accuracy 5 μm
  • Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm
  • Working area up to 450 mm x 234 mm
  • Supports wafer/substrate sizes up to 200 mm
LPKF Minicotac RS

LPKF Minicotac RS

For plating via holes in prototype printed circuit boards

  • Maximum size board 9” x 12”
  • Minimum via size 0.4mm
LPKF Multi-press S

LPKF Multi-press S

For laminating multiple layers of printed circuit boards

  • Laminating area 9” x 12”
  • Up to 8 layers

Additional Equipment

  • Vector Network Analyzer: Keysight E5071c 8.5 GHz with Ecal kit
  • Solder Rework Station: Weller wha3000
  • Wire Bonders(2): TPT HB16 (stud bump and bump/wedge)
  • DC triple power supplies (4): Keysight E3631a
  • Logic Analyzer: Keysight 16806
  • DC Sourcemeters(2): Keysight B2901
  • Oscilloscope 1GHz: Keysight MSOX3104a
  • Oscilloscope handheld: Keysight U1620a

Staff

    • High Frequency Sensor Development Laboratory & Sensor Integration Codirector 

    Joseph Bardin

    • High Frequency Sensor Development Laboratory & Sensor Integration Codirector 

    Robert Jackson

  • Location

    S469 Life Science Laboratories
    University of Massachusetts Amherst
    240 Thatcher Road
    Amherst, MA 01003