
Fabrication of Miniaturized Electronic Systems
Equipment

Summit 11000 Probe Station with Laser Cutter
For measuring and modifying prototype integrated circuits
- EZLaze3 laser cutter:
- for cutting metal traces (532 nm)
- for removing passivation (355 nm)
- Objectives: M Plan Apo NUV 50X, 100X

Advanced Dicing Technology 7122
For precision dicing of hard material components such as
silicon wafers
- Work piece size: up to 200mm x 200mm
- Indexing: resolution/accuracy is 0.2 μm/1.5 μm
- Cut Depth: resolution/accuracy is 0.2 μm/2.0 μm

LPKF Protolaser U3
For prototyping of printed circuit boards
- Diameter of UV laser beam 20μm
- Resolution of scanfield 2μm
- Repeatability +/- 2μm
- Surface structures down to 75μm
- Max material size 9” x 12” x 0.27”

FineTech FINEPLACER pico ma
For flip chip bonding and die attach
- Placement accuracy 5 μm
- Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm
- Working area up to 450 mm x 234 mm
- Supports wafer/substrate sizes up to 200 mm

LPKF Minicotac RS
For plating via holes in prototype printed circuit boards
- Maximum size board 9” x 12”
- Minimum via size 0.4mm

LPKF Multi-press S
For laminating multiple layers of printed circuit boards
- Laminating area 9” x 12”
- Up to 8 layers
Additional Equipment
- Vector Network Analyzer: Keysight E5071c 8.5 GHz with Ecal kit
- Solder Rework Station: Weller wha3000
- Wire Bonders(2): TPT HB16 (stud bump and bump/wedge)
- DC triple power supplies (4): Keysight E3631a
- Logic Analyzer: Keysight 16806
- DC Sourcemeters(2): Keysight B2901
- Oscilloscope 1GHz: Keysight MSOX3104a
- Oscilloscope handheld: Keysight U1620a
Staff
Location
S469 Life Science Laboratories
University of Massachusetts Amherst
240 Thatcher Road
Amherst, MA 01003