Technologies for the Fabrication of Micro and Nano Devices

Located on the 1st floor in the Silvio O. Conte National Center for Polymer Research the Nanofabrication facility is part of a network of cleanroom laboratories that offer both unique and complimentary capabilities. Training can be tailored to the specific set of processes or techniques needed to fabricate and test various devices or materials. Films of numerous metals and ceramics can be applied and patterning as small as 10 nm can be accomplished. A wet chemistry area provides a safe environment for the use of a variety of coatings, solvents, and etchants.

The facility accepts samples and will perform requested analysis. We offer training to users to conduct experimentation for use on a fee for service basis to both internal and external researchers, academic or industry based. Following an initial consultation, covering experimental parameters training and access is arranged through the director.

Equipment

JEOL JSM-7001F Ebeam Writer with Nanometer Pattern Generation System

The Electron Beam Lithography system is based on a JEOL JSM-7001F Thermal Field Emission SEM equipped with a Nabity Nanometer Pattern Generation System which supports e-beam lithography and an image database.

AJA International Orion 8 Sputtering System with Load Lock Chamber

The load-locked AJA ORION 8 Sputtering System currently has three RF and four DC confocal magnetron sputtering sources installed. Current source materials available include copper, aluminum, silicon dioxide, titanium dioxide, aluminum oxide, indium tin oxide, magnesium oxide, tantalum oxide, cobalt, palladium, niobium, silver, nickel, tantalum, sammarium, sammarium cobalt, zirconium, chromium, vanadium, and Permalloy (Ni/Fe). Programmable control of deposition parameters and cycling allows simultaneous or sequential deposition and repetition of deposition cycles. Substrate heating up to 750°C is also programmable.

Cambridge NanoTech Atomic Layer Deposition (ALD) System

The Cambridge NanoTech Savannah 100 Atomic Layer Deposition (ALD) system is available to deposit very conformal and precise thicknesses of various thin films. Our unit can currently be configured with the precursor chemicals to deposit hafnium oxide, aluminum oxide, titanium dioxide, zinc oxide, and platinum.

Ferrotec TLab E-beam Evaporator

Metallization for the processing of semiconductor based substrates, controlled multi-layer coatings of materials such as Ti, Pt, Au, Pd, Ag, Ni, Al, Cr, Cu, Mo, Sn, SiO2 and ITO.

SUSS MicroTec MA6 Mask Aligner

A UV mask aligner and exposure system with split screen stereo camera alignment system capable of both front and back side alignment of from 2” to 6” diameter substrates.

Developer Hood

The Developer Hood has a flowing deionized water rinse sink and developer solution sinks for the positive and negative resists commonly used in the facility. DI rinse wands and N2 guns are provided.

Olympus BH2 Microscope with Infinity 2 Digital Camera

The Olympus BH2 Microscope with Infinity 2 high resolution (2080x1536 pixel) digital camera is capable of up to 1000x magnification and has a 6 in. x 6 in. stage with manual positioning lever and xy stage control knobs. Image captures on the attached notebook computer canbe analyzed, labeled or formatted, and saved to network storage areas via the internet. Nosepiece rotation is under push button control.