The University of Massachusetts Amherst
 
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Byung Kim

Professor

High aspect ratio nano patterning on continuously moving thermoplastic substrates, point of care detection of pathogens and cancers on disposable SERS activated substrate, protein dynamics simulation based on elastic network interpolation (ENI) and elastic network based normal mode analysis (EN-NMA), antifungal activities of silver ions and nanoparticles.

Current Research
Nanotechnology requires the feature size in nanometer scale. Nanometer length scale exhibits extraordinary mechanical, optical, electrical, magnetic, thermal properties. In order to exploit such useful property in wide range of application areas, nano features must be cost effectively produced. Although a continuous, roll-to-roll process exist in replicating nanofeatures, it is currently limited to low aspect ratio or ultra violet light curable resins and the fidelity of the replication still needs a lot of improvements. My current research is aimed at fundamental research to provide needed knowledge for the development of continuous imprinting of high aspect ratio nano features on any types of thermoplastic polymers. Thermoplastic polymers with versatile physical and chemical properties are highly desired in numerous disposable devices for the application nanotechnology in the area of energy, healthcare, biomedical, chemical or automotive, telecommunication industry. It is anticipated that results of my current research effort will construct a scientific basis to facilitate successful transfer of this novel nanomanufacturing technology to industry.

Learn more at mie.umass.edu/faculty/byung-kim

Academic Background:

  • U.C. Berkeley, B.S. 1978
  • MIT, M.S., 1980
  • MIT, Ph.D., 1983
T.E. Kimerling, W. Liu, B. Kim, and D. Yao, "Rapid Hot Embossing of Polymer Microfeatures", Microsystems Technologies, Vol. 12, No. 8, pp. 730-735, 2006.
S. Kim, C-S Shiau, D. Yao, B.H. Kim, “Injection Molding Nanoscale Features with the Aid of Induction Heating,”Polymer/Plastics Technology Engineering, 46: 1031-1037, 2007.
O. Nezuka, D. Yao, and B. H. Kim, “Replication of Microstructures by Roll-To-Roll UV-curing Embossing, Polymer/Plastics Technology Engineering, 47: 865-873, 2008.
Young-Ki Jo, Byung H. Kim and Geunhwa Jung “Antifungal activity of ionic and nanoparticle silver on phytopathogenic fungi,” Plant Disease, Vol. 93 No.10, 1037- 1043, 2009.
Matthew D. Fagan, Byung H. Kim, Donggang YaoA Novel Process for Continuous Thermal Embossing of Large-Area Nanopatterns onto Polymer Films, , Advances in Polymer Technology, Vol. 28, No, 4, 246-256, 2009.
Mingwen Hu and Byung Kim, "Flexibility of the Exportins Cse1p and Xpot Depicted by Elastic Network Model," Journal of Molecular Modeling. Vol.17,1735-1741, 2011.
Ming-Wen Hu, Brian O'Riordan, Byung Kim and Moon Ki Kim, “Comparison of all-atom and coarse-grained normal mode analysis in the elastic network model,” Journal of Mechanical Science and Technology, 27 (11) 3267-3275, 2013.
Sung-Hoon Park, Eun-Hyoung Cho1, Jinseung Sohn, Paul Theilmann, Kunmo Chu, Sunghee Lee, Yoonchul Sohn, Dongouk Kim, and Byunghoon Kim, “Design of multi-functional dual hole patterned carbon nanotube composites with superhydrophobicity and durability,” Nano Research, 6(6): 389,398, 2013.
Ming-Wen Hu, Chiung-Fang Hsu, Byung Kim “The Intrinsic dynamics of Cse1p and Xpot elucidated by coarse-grained models,” Computational Biology and Chemistry, Vol. 48, 45-54, 2014.
Raymond Frenkel, Byung Kim *, Donggang Yao, “Extrusion Roller Imprinting with a Variotherm Belt Mold,” Machines,2, 299-311, 2014.
 
Contact Info

Department of Mechanical and Industrial Engineering
Elab 301
Governors Drive
Amherst, MA 01003

(413) 545-2005
kim@ecs.umass.edu

mie.umass.edu/faculty/byung-kim