Methods of Adhesion Promotion for Metal Films Deposited on Substrates

Primary Inventors: 

The invention describes methods and resulting structures in which a metal layer is adhered to a surface of a substrate.  The methods involve applying a sacrificial acidic organic layer to the substrate prior to depositing the metal layer.  The sacrificial layer is consumed, leaving behind a metal/substrae interface that has excellent adhesion properties. 


Fabrication of micro-electronics, such as integrated circuits 


The method reduces the amount of contaminating oxides, thus resulting in better adhesion and improved performance of the devices.

Licensing Status: 
Available for Licensing
Patent Status: 

Patent US 7,527,826  and US 7,709,959  issued

UMA 04-21
For More Information: 

Ling X. Shen, Ph.D., M.B.A.
Senior Licensing Officer
Commercial Ventures and Intellectual Property
Phone: 413-545-5276