A General Method for the Formation of Aryl-Sulfur Bonds

Primary Inventors: 

Dhandapani Venkataraman, Ph.D.

Description: 

This is a palladium free general method for the formatin of aryl-sulphur bonds from aryl-iodides using catalytic amounts of copper iodide and neocuproine (2,9-dimethylphenanthroline) as the catalyst.

Applications: 

This method replaces the use of expensive palladium based methods of synthesis for complex molecules or drugs, as well as eliminating the need for certain additives.

Advantages: 
  • Unlike palladium-based complexes, the Cu (I) complex catalyst is extremely inexpensive and easy to prepare
  • The Cu (I) complex is air stable, can be stored for long periods of time, and soluble in many organic solvents
  • The solvent used is toluene, not the more toxic and polar solvents DMF and pyridine as in prior art.
  • The reactions conditions are mild and tolerates various functional groups
  • Copper is used in catalytic amounts, instead of stoichiometric amounts
Licensing Status: 
Available for Licensing and Research Collaboration
Patent Status: 

US Patent 7,112,697 issued

Docket: 
UMA 03-12
For More Information: 

Commercial Ventures and Intellectual Property
Phone: 413-545-3606
E-mail: cvip@research.umass.edu