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Sensor Integration

Sensor Integration

Equipment for precise integration of optical and electronic components into compact systems. Tools and equipment are available for wafer dicing, die mounting and alignment, and wirebonding and metal trim providing a complete set of capabilities for preparing sensors and integrated systems for evaluation and test.

  • Vector Network Analyzer E5071c 8.5 GHz
  • Flip Chip Bonder Finetech FINEPLACER
  • Wafer Saw Advanced Dicing Technology 7122
  Campus Users External Users
Lab Access (per user) $250/quarter $500/quarter
Technical assistance/training $45/hour $90/hour
Rates are subject to change, contact facility to verify current fees.
Updated June 7, 2017
Facility Staff

S469 Life Science Laboratories
University of Massachusetts Amherst
240 Thatcher Road
Amherst, MA 01003

Facility Leadership