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Suss Microtec MA6 Mask Aligner

Nanofabrication Cleanroom

Provide nanofabrication tools and services to researchers, students, and off-campus clients on a fee for services basis. Supports research and development through provision of technologies for the fabrication of micro and nano devices and complements the activities for the Device Fabrication Core Facility and the Roll to Roll Core Facility.

  • JEOL JSM-7001F Ebeam Writer with Nanometer Pattern Generation System

    The Electron Beam Lithography system is based on a JEOL JSM-7001F Thermal Field Emission SEM which has a large, 5-axis, fully eucentric, motorized, automated specimen stage, a one-action specimen exchange airlock and small probe diameter even at large probe current and low voltage. The specimen chamber handles specimens up to 200mm in diameter. The Windows XP based computer interface includes function buttons that switch operation modes quickly and easily. The FESEM has been set up specifically for EBL and is not available for general SEM imaging needs. Other equipment in the Electron Microscopy core facility is available for SEM imaging.The JSM-7001F FESEM is equipped with a Nabity Nanometer Pattern Generation System which supports e-beam lithography, and an image database. System configuration is still ongoing but patterns with lines down to 25 nm have been successfully written.

  • STS Vision 310 Mark II PECVD System

    STS Vision 320 Mark II PECVD SystemThe STS Vision 310 Plasma Enhanced Chemical Vapor Deposition system is equipped with a patented frequency generator (500W at 187 kHz and 300W at 13.56 MHz) that allows for the deposition of low stress films. It is configured for the growth of silicon dioxide, silicon nitride, and amorphous silicon. Available gases are 2% silane/nitrogen, ammonia, nitrous oxide, tetrafluoromethane, oxygen, and nitrogen. The sample plate can accommodate substrates up to 305 mm in diameter with a 250 mm diameter growth area, and has temperature control from 30oC to 380oC. Opening and closing of the chamber is automatic via a pnematically controlled hoist mechanism. Basic standard growth recipes are available.

  • STS Vision 320 Mark II RIE System

    The STS Vision 320 Reactive Ion Etch system is configured to etch silicon dioxide, silicon nitride, and amorphous slicon. Available gases are hydrogen, methane, sulphur hexafluoride, trifluoromethane, oxygen, argon, and nitrogen. The chamber will accomodate substrates up to 305 mm but has a 250 mm usable electrode diameter and has a 600W 13.56 MHz RF generator with automatic matching network. Opening and closing of the chamber is automatic via a pneumatically controlled hoist mechanism.

  • Gaertner L116C Ellipsometer

    Gaertner L116C EllipsometerThe Gaertner L116C Ellipsometer offers noncontact measurement of transparent and translucent films using a 632.2 nm wavelength HeNe laser. The rotating analyzer samples 144 data points and can measure films of thickness from 0 to 60000 Å with an accuracy of +/-3 Å and a repeatability of +/-1 Å over most of the measurement range.

  • AJA International Orion 8 Sputtering System with Load Lock Chamber

    The load-locked AJA ORION 8 Sputtering System currently has two RF and four DC confocal magnetron sputtering sources installed. The chamber has room for seven sources along with an ion mill which will eventually be installed. Current source materials available include copper, aluminum, silicon dioxide, titanium dioxide, aluminum oxide, indium tin oxide, magnesium oxide, tantalum oxide, cobalt, palladium, niobium, silver, nickel, tantalum, sammarium, sammarium cobalt, zirconium, chromium, vanadium, and Permalloy (Ni/Fe). Vacuum pumping cycles are under automatic control for both the chamber and load-lock area. Cycle time exclusive of the deposition period can be as low as 20 minutes due to the load- lock chamber access. Programmable control of deposition parameters and cycling allows simultaneous or sequential deposition and repetition of deposition cycles. Substrate heating up to 650 C is also programmable. The substrate area may also be biased for plasma cleaning prior to deposition (RF1). Argon, nitrogen, and oxygen plasmas are possible. Substrate rotation up to 20 RPM along withconfocal sources provides very uniform deposition. The deposition thickness monitor is mounted on a swing- away arm to remove it from the substrate area during deposition.

  • CHA Electron Beam Evaporator with Cryopump

    The CHA SE-600 electron beam evaporator with a 4 pocket hearth has been retrofitted with a cryopump to decrease the pumping cycle time. Current deposition metals available include gold, germanium, nickel, chromium, cobalt, iron, nickel-iron, copper, aluminum, palladium, silver, platinum, niobium, and titanium. Fixed position substrate holders are available to fit single wafers of any size and up to eighteen 3” diameter wafers at one time. Substrate rotation is currently not available.

  • Cambridge NanoTech Savannah 100 Atomic Layer Deposition (ALD)

    The Cambridge NanoTech Savannah 100 Atomic Layer Deposition (ALD) system is available to deposit very conformal and precise thicknesses of various thin films. Our unit can currently be configured with the precursor chemicals to deposit hafnium oxide, aluminum oxide, titanium dioxide, and platinum. This model can be set up with two of those systems at one time so check with the lab manager for the current configuration or to request an alternate chemistry. The system chamber can accommodate substrates up to 4 inches in diameter. Surface topographies with aspect ratios greater than 2000:1 have been successfully coated using this model of ALD in Exposure Mode. Currently available precursors allow deposition of hafnium oxide, aluminum oxide, titanium dioxide, zinc oxide, and platinum.

  • Wentworth MP-2300 Probe Station

    The Wentwort MP-2300 semiautomatic 200mm wafer prober is equipped with Labmaster 5.1 probing environment software and has a motorized XY- theta stage with 203mm x 203mm XY travel with 0.1um resolution and 5 mm Z travel and a 200mm nickel plated wafer chuck with vacuum hold down. Probers include a CAP3000 computer assisted probe with 0.1 um resolution, a CAP4000 submicron computer assisted probe with 0.01 um resolution and two lower resolution manual probers. A Mitutoyo FS-70 microscope with motorized xyz movement and M Plan Apo 5x,10x,20x objectives and Pulnix TMC-7 CCD camera with flat panel monitor and motorized focus allow for visual scanning and image capture. A Newport Cleantop II vibration isolation table with maximum damping and a laminar flow hood provide a controlled probing environment.

  • Keithley 4200 SCS Parametric Analyzer

    The Keithley 4200 Semiconductor Characterization System is a parametric analyzer with a Windows XP based software environment which provides for measurement of DC I-V, C-V, and pulse characterization and stress- measurement/reliability testing of semiconductor devices and test structures. This instrument is equipped with a Capacitance Voltage Unit capable of nanoFarad (nF) level measurements at frequencies from 10kHz to 10MHz and also two Source-Measure Units with 1A/20W capability. Two Remote PreAmps extend the resolution of both SMUs from 100fA to 0.1fA.

  • Dektak 3 Profilometer

    The Veeco Dektak3 surface profile measurement system is capable of scans up to 30 mm with a 10 Å repeatability and the sensitivity to measure step heights below 100 Å.

  • March Instruments PM-600 Plasma Treatment System

    The PM-600 is a large barrel benchtop plasma system with a 13.56 MHz RF generator having an output power of up to 600W for stripping photoresist, cleaning substrates, and mild etching. It has a 10 in. diameter by 12 in. long quartz chamber with an 8 inch by 8 inch flat quartz glass substrate rack Quartz glass wafer racks are available for 3” diameter wafers. It is microprocessor based with automatic sequencing and manual override.

  • Nikon Optophot Microscope with Infinity 2 Digital Camera

     

  • Blue M Convection Oven

     

  • OAI 1000 Watt DUV Exposure System

    The OAI 1000 Watt DUV Exposure System is capable of exposing substrates up to 150 mm diameter to a 1000W ~250nm wavelength deep ultra-violet light source. Samples are placed in the exposure chamber and the time of exposure can be varied - the power setting is always 1000W.

  • Olympus BH2 Microscope with Infinity 2 Digital Camera

    The Olympus BH2 Microscope with Infinity 2 high resolution (2080x1536 pixel) digital camera is capable of up to 1000x magnification and has a 6 in. x 6 in. stage with manual positioning lever and xy stage control knobs. Image captures on the attached notebook computer canbe analyzed, labeled or formatted, and saved to network storage areas via the internet. Nosepiece rotation is under push button control.

  • SUSS MicroTec MA6 Mask Aligner

    The SUSS MA6 Mask Aligner is capable of aligning and exposing substrates from 50 mm to 150 mm in diameter using a 400 nm 350W UV lamp. Its very good exposure field uniformity and light intensity control can give submicron image resolution results in vacuum contact mode with proper attention to photolithography process and substrate cleanliness standards. Two exposure intensity channels are provided over which the user can vary the time of exposure for proper image sharpness. An additional integrating radiometer can be used to meter UV dosage to tailor exposures to the photoresist manufacturers specifications. Backside alignment using topside and bottomside video cameras is possible. Dual cameras on both sides facilitate rapid mask to substrate alignment.

  • Brewer Science CEE 100CB Spin Coater

    Brewer Science CEE 100CB Spin CoaterThe Brewer Science CEE 100CB Spin Coater is capable of storing up to 10 spin regimes which may include spin speed ramp rate, stepped spin speeds, and a nitrogen float or vacuum hot plate contact mode for photoresist curing. Chucks for substrates from 1” to 6” diameter are available. An auxilliary hotplate is available alongside for 2 stage curing requirements.

  • Developer Hood

    The Developer Hood has a flowing deionized water rinse sink and developer solution sinks for the positive and negative resists commonly used in the facility. DI rinse wands and N2 guns are provided.

  • Sonoplot GIX Microplotter II

    • Noncontact deposition
    • Features as small as 5μm
    • Viscosities up to 450 cP
    • True contiguous lines, arcs, and bends
    • Consistent spot size and shape with coefficients of variability as low as 10%
    • 3-axis positioning with 5μm resolution
    • Integrated digital video capture
    • Automated surface calibration
    • Interchangeable holding platen for a variety of substrate sizes
    • SonoGuide™ software for full automation and control
    • SonoDraw™ software as a CAD layout tool
  Campus Users Other Academic Institutions Industry
Annual Access $1,200 $1,500 $2,500
Additional Users $60/month $75/month $95/month
Equipment Usage $40/hour $40/hour $65/hour
Technical Assistance $40/hour $40/hour $65/hour
Special Materials and Processes $50/each $50/each $50/each
Rates are subject to change, contact facility to verify current fees.
Updated March 13, 2017

Facility Online Manager (FOM) (access and reservations)

Gowning Room Door RIE/PECVD Metalization Wet Chemistry Photolithography E-Beam

Facility Staff
Location

B111 Silvio O. Conte National Center for Polymer Research
University of Massachusetts Amherst
120 Governors Drive
Amherst, MA 01003

Centers
  • The nanofabrication facility at UMass Amherst played a central role in my research on measuring electrical properties of bacterial protein filaments and biofilms. Personal guidance from the facility director John Nicholson helped us in designing appropriate micrometer and nanometer-sized electrodes. He was instrumental in helping us in low level electrical measurements with the probe station and training graduate students with this challenging project. I have no doubt that many other groups will continue to benefit for John's attention to detail and his decades of experience in running and managing a top-notch research facility with state-of-the art instrumentation."

    —Nikhil Malvankar (Yale University)